Improvements in Thin Wafer Handling – Equipment and Material Impacts

How Cee® equipment is used

The experimental tool list names the Cee® 1300CSX slide debonder. The paper compares temporary-bonding materials and describes support of the released wafer through transfer to tape mounting. This is a jointly authored customer and supplier study, separate from the team's 2013 fabrication paper.

Equipment reported

Cee® 1300CSX

Source type

Customer/supplier conference paper

Publication year

2014

Materials

Temporary Bonding Adhesive

Substrate

Not reported

Source

TriQuint and Brewer Science, CS MANTECH

Process context

The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Temporary Bonding Adhesive.