Patent

Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes

The patent reports cleaning of temporary-bonding adhesive after wafer debonding.

How Cee® equipment is used

Brewer Science's patent examples identify a Cee® 200FX for cleaning adhesive residues after temporary-wafer release. The examples also name a Brewer Science peel debonder, without establishing an Apogee® debonder model.

Equipment reported
Cee 200FX; Brewer Science peel debonder
Source type
Patent experimental example
Publication year
2018
Materials
Cyclic olefin polymer
Substrate
Not reported
Source
Brewer Science — Published Patent Examples

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Cyclic olefin polymer.

Source and equipment evidence

Brewer Science — Published Patent Examples. 2018. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes.

Open original source ↗

Application summary prepared by Cee. The original source remains the authority for its methods and findings.

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