Patent
Apparatus, hybrid laminated body, method, and materials for temporary substrate supportCee spin coating equipment; model unspecified
The patent reports cleaning of temporary-bonding adhesive after wafer debonding.
Brewer Science's patent examples identify a Cee® 200FX for cleaning adhesive residues after temporary-wafer release. The examples also name a Brewer Science peel debonder, without establishing an Apogee® debonder model.
This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Cyclic olefin polymer.
Brewer Science — Published Patent Examples. 2018. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.