Patent
Room Temperature Debonding Composition, Method and StackCee® 100CB
This patent describes polyamide priming layers for temporary wafer-support laminates. The workflow uses Cee spin coating equipment; model unspecified.
An experimental example identifies Cost Effective Equipment spin coating for a thermoplastic polyamide priming layer on a wafer. The documented Cee role is coating or layer preparation within the temporary-support process.
This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.
Google Patents. Apparatus, hybrid laminated body, method, and materials for temporary substrate support.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.