Patent
Apparatus, hybrid laminated body, method, and materials for temporary substrate supportCee spin coating equipment; model unspecified
This patent describes fluorinated silane release surfaces for thin-wafer temporary bonding and handling. The workflow uses Cee® 100CB.
Examples1–6 solutions coated on100mm silicon using Cee100CB and then baked on the Cee100CB hotplate. The documented Cee role is coating or layer preparation within the temporary-support process.
This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims.
Google Patents. Fluorinated silane coating compositions for thin wafer bonding and handling.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
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Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
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