Patent

Room Temperature Debonding Composition, Method and Stack

This patent describes room-temperature temporary-wafer debonding with polymer layers. The workflow uses Cee® 100CB.

How Cee® equipment is used

Experimental section explicitly identifies the CEE100CB at Promerus; collaborators at Sumitomo used a separate SOKUDO tool. The documented Cee role is coating or layer preparation within the temporary-support process.

Equipment reported
Cee® 100CB
Source type
Patent experimental example
Publication year
Not recorded
Materials
Temporary Bonding Adhesive
Substrate
Not reported
Source
Google Patents

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.

Source and equipment evidence

Google Patents. Room Temperature Debonding Composition, Method and Stack.

Open original source ↗

Application summary prepared by Cee. The original source remains the authority for its methods and findings.

SEMICON EUROPA · 10–13 NOVEMBER

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Stand C1353 · Messe München
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