Patent
Apparatus, hybrid laminated body, method, and materials for temporary substrate supportCee spin coating equipment; model unspecified
This patent describes room-temperature temporary-wafer debonding with polymer layers. The workflow uses Cee® 100CB.
Experimental section explicitly identifies the CEE100CB at Promerus; collaborators at Sumitomo used a separate SOKUDO tool. The documented Cee role is coating or layer preparation within the temporary-support process.
This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.
Google Patents. Room Temperature Debonding Composition, Method and Stack.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.