Patent
Apparatus, hybrid laminated body, method, and materials for temporary substrate supportCee spin coating equipment; model unspecified
This patent describes spin-applied temporary support for inorganic microelectronic substrates. The workflow uses Cee® CB-100 (source wording).
Process applies liquid support material with a Brewer Science CB-100 coater. The documented Cee role is coating or layer preparation within the temporary-support process.
This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.
Google Patents. Rapid fabrication of a microelectronic temporary support for inorganic substrates.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
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Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
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