Patent

Rapid fabrication of a microelectronic temporary support for inorganic substrates

This patent describes spin-applied temporary support for inorganic microelectronic substrates. The workflow uses Cee® CB-100 (source wording).

How Cee® equipment is used

Process applies liquid support material with a Brewer Science CB-100 coater. The documented Cee role is coating or layer preparation within the temporary-support process.

Equipment reported
Cee® CB-100 (source wording)
Source type
Patent experimental example
Publication year
Not recorded
Materials
Temporary Bonding Adhesive
Substrate
Not reported
Source
Google Patents

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.

Source and equipment evidence

Google Patents. Rapid fabrication of a microelectronic temporary support for inorganic substrates.

Open original source ↗

Application summary prepared by Cee. The original source remains the authority for its methods and findings.

SEMICON EUROPA · 10–13 NOVEMBER

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Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.

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