Room temperature debondable and thermally curable compositions

How Cee® equipment is used

Example28 application coats TSV silicon on a CEE-spinner CB-100 from Brewer Science. This2014-priority composition differs from the2012-priority room-temperature debonding family. The documented Cee role is coating or layer preparation within the temporary-support process.

Equipment reported

Cee® CB-100 (source wording)

Source type

Patent experimental example

Publication year

Not recorded

Materials

Temporary Bonding Adhesive

Substrate

Si

Source

Justia Patents

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.