Patent

Fluorinated silane coating compositions for thin wafer bonding and handling

This patent describes fluorinated silane release surfaces for thin-wafer temporary bonding and handling. The workflow uses Cee® 100CB.

How Cee® equipment is used

Examples1–6 solutions coated on100mm silicon using Cee100CB and then baked on the Cee100CB hotplate. The documented Cee role is coating or layer preparation within the temporary-support process.

Equipment reported
Cee® 100CB
Source type
Patent experimental example
Publication year
Not recorded
Materials
Not reported
Substrate
Si
Source
Google Patents

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims.

Source and equipment evidence

Google Patents. Fluorinated silane coating compositions for thin wafer bonding and handling.

Open original source ↗

Application summary prepared by Cee. The original source remains the authority for its methods and findings.

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