Paper / report
Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometryCee 200 FX
This patent describes spin-on gap-fill materials for deep wafer topography. The workflow uses Cee spinners and hotplates; models unspecified.
The patent's experimental text identifies spinners and hotplates from Cost Effective Equipment in the fill-material preparation workflow.
This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims.
Google Patents. Solubility switch topographic fill materials and methods.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.