Apogee® 200 Bake Plate

X-Pro platform for use with up to 200mm wafers

End-to-End Solution

The Full Package

Enhance your process efficiency with the Apogee® Bake Plate as part of a fully integrated solution. Pair with other Apogee process modules in the X-Pro II Workstation for a smooth factory-direct setup that simplifies your workflow.

X-Pro Workstation

Whether you need a single tool or ten, fume control or a cleanroom environment, the Cee® X-Pro II Workstation is the perfect alternative to typical wet benches.

A fleet of Cee® full sized X-Pro II Workstations outfitted with various process modules for the processing of semiconductor substrates.

Plug and Play

Fume Control

Easy Maintenance

Engineered Performance

Reliable. Repeatable. Remarkable.

Enjoy unrivaled repeatability and uniformity in every bake process. Built for long-lasting durability and backed by lifetime process support, Apogee® Bake Plates are your ideal solution for automated bake processing.

Premium Features Built-In

Engineered for superior performance, usability, versatility—and peace of mind.

DataStream™ OS

- Included on every Apogee® Bake Plate

Knowledge is power. With DataStream™ technology, monitor and manage in real time, ensuring production-quality results from anywhere. Proactive warnings and detailed log files give you the information you need to succeed.

Unlimited Recipes, Unlimited Steps

Create and store unlimited recipes with unlimited steps. Use pre-defined commands to streamline your setup and execution.

Record Everything

Process parameters and measurements are logged in real-time. Export in multiple formats for analysis, troubleshooting, and process optimization.

Remote Access and Managment

Access your Apogee® Bake Plate remotely via any web browser for real-time monitoring, adjustments, and recipe management. Create, modify, upload, download, and archive recipes seamlessly.

Monitor All the Things

DataStream™ technology monitors key baking parameters—temperature, lift pin height, bake method, ambient temperature/humidity, and more— to ensure precise control for optimal results.
Safety

Leading the Charge

NRTL certification is crucial for semiconductor equipment, ensuring compliance with safety standards set by regulatory bodies like OSHA and ANSI.

Cee® bake plates are NRTL listed right out of the box…

…your safety department is going to love you.

Make the Best Even Better

When advanced processes require advanced features, Cee® has you covered. Personalize your bake plate right from the factory.

Apogee® 200 Bake Plate Specs -X-Pro

Max Substrate Size

200mm Round or 8″ x 8″ Square

Min Substrate Size

2 inch Round (smaller sizes supported with limited functionality)

Max Temperature

300°C (400°C optional)

Temperature Resolution

0.1°C

Temperature Uniformity

±0.3% across working area

Programmablility
GUI

7″ Full Color Touchscreen (included)

Smart Pin­™ Height Range

0-19 mm

Number of Recipes / Steps

Unlimited / Unlimited

Smart Pin­™ Resolution

0.1 mm

Step Time Resolution

0.1 s

Dimensions
Weight

65 lb (29.5kg) – Add X-Pro II Workstation for Final Weight

Shipping Weight (Equipment Only)

110 lb (50kg) – Add X-Pro II Workstation for Final Shipping Weight

Dimensions

N/A (Pre-Installed Into X-Pro II Workstation)

Shipping Dimensions

N/A (Pre-Installed Into X-Pro II Workstation)

Utilities
Voltage

208-230 VAC (Supplied by X-Pro II Workstation)

N2/CDA

1/4″ Push to Connect, 35psi (241kPa) (Supplied by X-Pro II Workstation)

Full Load Current

6.3A (@208V) (Supplied by X-Pro II Workstation)

Vacuum

1/4″ Push to Connect, <20″ Hg (33kPa abs) (Supplied by X-Pro II Workstation)

Exhaust Port

2″ OD, 0.4” H2O@10CFM (100Pa@17 CMH)

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Need a Custom Solution?

With four decades of experience, our experts will collaborate closely with you to understand your requirements and deliver solutions that exceed expectations.

About Us
Leading the industry in high performance wafer-processing equipment since 1987.
An operator holding a patterned silicon wafer.