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SKU: 400C
The Cee® 400 °C Option extends the maximum operating temperature of Apogee® Bake Plates, enabling thermal processing at elevated temperatures beyond the standard configuration. In applications where materials require higher bake or cure temperatures, increased thermal capability becomes essential to achieve proper material transformation and process performance.
By expanding the available temperature range, the 400 °C Option supports advanced material systems and high-temperature processes while maintaining stable, controlled heating conditions.
The 400 °C Option increases the maximum allowable bake temperature, enabling processes that require elevated thermal energy.
Key capabilities include:
By enabling higher temperature processing without compromising control, the 400 °C Option provides additional flexibility for demanding applications.
Operating at elevated temperatures requires proper handling and adherence to facility safety practices. The 400 °C Option is designed to maintain safe operation while enabling higher thermal performance.
Users should ensure that all materials, substrates, and process conditions are compatible with elevated temperatures. Appropriate personal protective equipment and handling procedures should be followed when working at high temperatures.
No additional facility utilities are required beyond standard bake plate operation. The option is configured at the factory; conversion of a standard tool requires Cee® authorization. The Cool Touch Hood reduces heat transfer but does not eliminate burn hazards. PTFE lift-pin tips remain limited to 200°C and Vespel® tips to 300°C; neither is suitable for a 400°C process.
The Cee® 400 °C Option is available for all Apogee® mounting configurations, including benchtop, flange-mount, and integrated workstation installations.
Apogee® 200 Bake Plate
Apogee® 300 Bake Plate
400°C
Unchanged from the host bake plate
Unchanged from the host bake plate
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.