Circular Spin Chucks

Circular Spin Chucks provide vacuum holding for round wafers and rigid substrate pieces during coating, developing and cleaning.

  • Common circular chuck configurations kept in stock
  • A range of physical chuck diameters for different substrate sizes
  • Standard Delrin® construction, with other materials available
  • Individual chucks matched to your Cee tool and application

Also available as spin chuck sets

Choose a Small Diameter Set or Complete Set for work across several substrate sizes. Both include a base, extra O-rings and a storage case.

Select your tool and an option to see the SKU.

Need help centering a wafer? Select a handheld device matched to your wafer and chuck diameter.

Product Information

Vacuum Contact & Retention

A circular chuck holds the substrate through vacuum at the backside contact surface. The substrate must cover all vacuum surfaces to establish proper holding. A clean, flat contact area helps avoid vacuum faults and supports consistent placement between runs.

Centering & Handling

Place the substrate on the chuck, center it and follow the tool’s on-screen centering instructions before processing. Accurate centering becomes more critical as substrate size increases; a matched handheld centering device can help with placement. Spin speed and acceleration depend on the chuck, substrate size, thickness and weight, and the process recipe.

Materials & Routine Care

Standard chucks are Delrin®. Material options include PVDF, PTFE, stainless steel, PEEK and anodized aluminum; select for compatibility with the actual process chemistry. Inspect the contact surface for residue or damage, and remove the chuck from the tool before cleaning to keep solvent out of the vacuum system. Refer to the manual for installation and maintenance instructions.

Match the Chuck to the Substrate

Start with the substrate diameter or footprint and consult the Chuck Sizing Chart. Physical chuck diameter is different from the supported substrate range. Confirm thickness and backside contact requirements as well as diameter.

Choose an Individual Chuck or Set

An individual chuck suits a defined substrate size. Compare the two sets below for work across several sizes. Both sets in the selector are for the Apogee 200 Spin Coater/Developer.

Component
Small Diameter Set
Complete Set
1/8″ piece
Included
Included
5/16″ piece
Included
Included
1/2″ piece
Included
Included
3/4″ piece
Included
Included
1.5″ piece
Included
Included
2.25″ chuck
—
Included
4″ chuck
—
Included
Base
Included
Included
Extra O-rings
Included
Included
Storage case
Included
Included

Apogee 200 set SKUs: Small Diameter Set 903637; Complete Set 903495.

Confirm the Tool & Configuration

When requesting a quote, provide your Cee tool model, substrate dimensions, thickness and material, process chemistry, and the selected SKU. Confirm the spindle interface and whether a centering device is needed. Unusual shapes or restricted backside contact may call for a custom chuck.

Substrates

Standard circular wafers and pieces

Material

Delrin®
Contact Cee for other material options.

Configurations

Individual chucks and sets

Utilities & Tool Fit

Retention

Vacuum

Tool Interface

Confirm spindle and chuck compatibility

Operating Limits

Depend on chuck, substrate, and recipe

Find the right chuck for your substrate.