Overview

The Cee® Hood-Mounted Passive Chill Station provides a convenient location for cooling a single substrate after thermal processing on an Apogee® Bake Plate. Mounted on the exterior hood, it keeps the cooling surface close to the bake plate while minimizing the need for additional bench space.

Key Capabilities

• Passive cooling without refrigeration or additional utility connections
• A substrate-access notch for compatible tweezers or a vacuum wand
• An angled surface and front stops to help position the substrate
• A station size matched to the host bake plate and installed configuration

Operation

Use suitable thermal PPE and wafer-handling tools to remove the substrate from the bake plate. Close the hood before centering the substrate on the exterior chill station. Remove the substrate before opening the hood again.

Cooling time varies with substrate size, thermal mass, starting temperature, surface contact, ambient airflow, and the required final temperature. Measure temperature when it is critical to the next process step; do not assume a fixed cooldown time.

Safety & Facilities

The station is factory-installed and requires no additional facility utilities. Treat recently loaded substrates and contact surfaces as hot. Confirm the station is securely mounted, clean, and undamaged before use. Once cool, clean with a nonabrasive cloth and an agent compatible with the station surface and process residue.

Compatibility

For Apogee® Bake Plates configured with the hood-mounted chill option. Maximum substrate size is governed by the host plate size and installed station configuration.