Recessed Spin Chucks

Recessed Spin Chucks are typically recommended for spin coating square and rectangular substrates. A substrate-matched cavity locates the piece within the chuck surface, providing a repeatable fit for photomasks, microscope slides and similar substrates.

  • Typically recommended for rectangular spin-coating applications
  • Cavity matched to substrate width, length and thickness
  • Recess establishes the substrate position when correctly loaded
  • Material and contact geometry selected for the process

Made to order

Each recessed chuck is custom made for your substrate dimensions and process requirements.

SKU unavailable — custom made to order.

Developing or cleaning a rectangular substrate?

Product Information

A Chuck Shaped Around the Substrate

A square or rectangular substrate presents a different coating geometry from a circular wafer. The recessed design places the substrate in a machined cavity made for its footprint and thickness. Typical applications include microscope slides, photomasks, displays and other rectangular pieces. A correctly loaded substrate is centered by the recess, so a separate centering device is not needed. Finger access features assist removal on the supplied recessed configuration.

Support for Coating at Corners and Edges

The surrounding chuck surface emulates a round wafer to reduce airflow turbulence around a square or rectangular substrate and improve coating uniformity at the corners and edges. The recess is matched to the substrate dimensions and process requirements.

Recessed vs. Captive Spin Chucks

Comparison
Recessed Chuck
Captive Chuck
Typical processes
Spin coating
Developing and cleaning
Corner uniformity
Emulates a round wafer to improve coating uniformity at corners and edges
Typically used when corner coating uniformity is less critical or the process allows an exclusion area
Substrate retention
Vacuum pad
Vacuum or mechanical holding, depending on configuration
Cleaning
More surrounding chuck material to clean
Typically requires less cleaning because there is less chuck material
Backside contamination
Designed to minimize backside contamination; results depend on the process
Designed to minimize backside contamination; results depend on the process

Specify the Substrate

Provide width, length, thickness and material, plus a drawing when the outline has special features. Include the permitted contact areas, process chemistry and Cee spin-coater model. These details define the recess and its fit.

Choose the Material and Interface

Construction options include Delrin®, PVDF, PTFE, stainless steel, PEEK and anodized aluminum. The selection depends on chemistry, contact needs and the tool configuration. Confirm the spindle interface and intended process conditions together.

Use the Matched Piece

Each recessed chuck is made for specific substrates. Use the specified installation, loading and removal procedures, and keep the matched substrate and recess together. A piece that fits loosely in an existing cavity is not automatically an appropriate match.

Substrates

Square and rectangular pieces

Typical Process

Spin coating

Positioning

Substrate-matched recess

Utilities & Tool Fit

Retention

Vacuum; confirm supplied configuration

Tool Interface

Matched to the specified Cee tool

Operating Limits

Defined for substrate and process

Find the right chuck for your substrate.