Paper / report
Snapshot Redox Cycling Voltammetry (Snapshot RCV): Fast Generation-Collection Detection across a Wide Potential Range at a Chip-Based Microelectrode ArrayCee 200CBX
The study reports resist coating and bake processing for a bonded-silicon CT reference object.
Jeffery Thousand's doctoral research identifies a Cee® 200 and Cee® 1100FX for resist coating and bake processing. These steps support fabrication of a directly bonded silicon reference object for computed tomography; the source does not attribute the bonding step to a Cee® bonder.
The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Photoresist.
UNC Charlotte Doctoral Thesis. 2020. Development of an Adaptive X-ray Research Facility and a Direct Bonded Silicon Reference Object for Computed Tomography.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
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