Paper / report
Novel Polymeric Protective Coatings for Hydrofluoric Acid Vapor Etching During MEMS Release EtchCee® 100CB
This thesis describes bilayer-resist lift-off for back-gated semiconductor Schottky contacts. The workflow uses Cee® 100CB.
Fabrication methods identify Cost Effective Equipment100CB for photoresist coating and bake. Cover/metadata verify Yulu Che,Ohio State,2010.
The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Photoresist.
OhioLINK Theses. 2010. Ambipolar Ballistic Electron Emission Microscopy Studies of Gate-field Modified Schottky Barriers.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.