Paper / report

Novel Polymeric Protective Coatings for Hydrofluoric Acid Vapor Etching During MEMS Release Etch

This study describes HF-resistant polymer coatings protecting MEMS during release etching. The workflow uses Cee® 100CB.

How Cee® equipment is used

Brewer Science/Primaxx paper explicitly applies and bakes protective polymer films using the Cee100CB.

Equipment reported
Cee® 100CB
Source type
Industry conference paper
Publication year
2010
Materials
Not reported
Substrate
Not reported
Source
Brewer Science — iMAPS Device Packaging Conference

Process context

The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration.

Source and equipment evidence

Brewer Science — iMAPS Device Packaging Conference. 2010. Novel Polymeric Protective Coatings for Hydrofluoric Acid Vapor Etching During MEMS Release Etch.

Open original source ↗

Application summary prepared by Cee. The original source remains the authority for its methods and findings.

SEMICON EUROPA · 10–13 NOVEMBER

Bring your process questions.

Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.

Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.

Book a stand meeting →

Mention Jacob from CEE in SiSTEM’s booking form.