No more compromising with ovens and cheap hotplates that fail to deliver. Apogee® Bake Plates are engineered for thermal performance, delivering ultimate uniformity and consistancy. Expect perfect processing results with stability and repeatability you can trust.
Whether it’s multi-stage baking or substrates sensitive to thermal shock, the Apogee® Bake Plate Smart Pins™ allow for advanced management of temperature profiles and ramping.
When you need flexibility, Apogee® Bake Plates adapt effortlessly accommodating various sizes, shapes, and thicknesses without downtime or tool changes. With multiple bake methods—including vacuum, gas-proximity, gravity contact, and Smart Pins™—you get precise control for every process.
Preheat your Apogee® Bake Plate while you sip coffee and check emails. The DataStream™ interface lets you set temperatures and monitor real-time readings from your desk—no cleanroom gowning required. Stay in control without skipping a beat.
Say goodbye to costly downtime. With durable construction and precision engineering, you’ll enjoy consistent results shift after shift, year after year. Trust in performance that stands the test of time.
| Model(Mounting style) |  Apogee® 200 Bake Plate(Benchtop) |  Apogee® 200 Bake Plate(Flange-Mount) |  Apogee® 200 Bake Plate(X-Pro) |  Apogee® 300 Bake Plate(Benchtop) |  Apogee® 300 Bake Plate(Flange-Mount) |  Apogee® 300 Bake Plate(X-Pro) |
|---|---|---|---|---|---|---|
| SKU | A-B-B2-1 (110 V) A-B-B2-2 (220 V) | A-FP-B2-1 (110 V) A-FP-B2-2 (220 V) | A-X-B2-2 | A-B-B3-2 | A-FP-B3-2 | A-X-B3-2 |
| Min substrate size | 2 inch round (smaller sizes supported with limited functionality) | 2 inch round (smaller sizes supported with limited functionality) | 2 inch round (smaller sizes supported with limited functionality) | 4 inch round (smaller sizes supported with limited functionality) | 4 inch round (smaller sizes supported with limited functionality) | 4 inch round (smaller sizes supported with limited functionality) |
| Max substrate size | 200mm round
or
8"x 8" square | 200mm round
or
8"x 8" square | 200mm round
or
8"x 8" square | 300mm round
or
12"x 12" square | 300mm round
or
12"x 12" square | 300mm round
or
12"x 12" square |
| Max temperature | 300°C (400°C optional) | 300°C (400°C optional) | 300°C (400°C optional) | 300°C (400°C optional) | 300°C (400°C optional) | 300°C (400°C optional) |
| Dimensions | W: 13.25” (337mm) D: 21” (533mm) H: 17.25” (439mm) | W: 15” (381mm) D: 18.5” (470mm) H: 5.5” (140mm) | See X-Pro II Workstation | W: 18.75” (477mm) D: 26.25” (667mm) H: 17.75” (451mm) | W: 28” (712mm) D: 25” (635mm) H: 6” (153mm) | See X-Pro II Workstation |
| 7″ touchscreen with DataStream™ control system and remote management | Included | Included | Included | Included | Included | Included |
| Input voltage | 100-120V or 208-230V | 100-120V or 208-230V | 208-230V | 208-230V | 208-230V | 208-230V |
Select any model column to view its equipment page.
Scroll sideways to compare all six models.
Engineered for superior performance, usability, versatility—and peace of mind.
On-board 7-inch color touchscreen with DataStream™ OS included for visibility and your ease-of-use.
Adjustable wafer stops for precise centering of various substrate sizes, round or square, for maximum versatility.
Featuring type III military-grade hardcoat anodized surface—ultra-flat, extremely scratch-resistant, and built to last.
Smart Pin™ Technology and precision ramping controls enable multi-stage baking and gentle warm-up for delicate, thermally sensitive substrates.
Recipe-controlled baking: with vacuum, gas-proximity, gravity contact, or Smart Pin™ Technology, you get complete process control.
NRTL certification is crucial for semiconductor equipment, ensuring compliance with safety standards set by regulatory bodies like OSHA and ANSI.
Cee® bake plates are NRTL listed right out of the box…
…your safety department is going to love you.
Knowledge is power. With DataStream™ technology, monitor and manage in real time, ensuring production-quality results from anywhere. Proactive warnings and detailed log files give you the information you need to succeed.
Process parameters and measurements are logged in real-time. Export in multiple formats for analysis, troubleshooting, and process optimization.
Access your Apogee® Bake Plate remotely via any web browser for real-time monitoring, adjustments, and recipe management. Create, modify, upload, download, and archive recipes seamlessly.
When advanced processes require advanced features, Cee® has you covered. Personalize your bake plate right from the factory.
Bake process sensitive to oxidation? Shield your wafer with a blanket of nitrogen or other inert gas with the N2 Purge option.
Crank up the heat! Upgrade your Apogee® Bake Plate to allow for processes that demand a high temperature bake.
Busy workbench? Give your wafer a dedicated cool-down spot. Bring fresh baked wafers to room temperature in seconds with the optional Chill Station.
With four decades of experience, our experts will collaborate closely with you to understand your requirements and deliver solutions that exceed expectations.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.
