SOP / protocol

Integrated photoresist processing in X-Pro II Workstations

George Mason University documents positive- and negative-resist workstations that combine coating, baking, and development within its photolithography workflow.

How Cee® equipment is used

The SOP identifies the Cee® X-Pro II Workstation. Individual module sizes are not specified; a separate instrument performs exposure.

Equipment reported
X-Pro II Workstation
Source type
SOP
Publication year
2025
Materials
Photoresist
Substrate
Not reported
Source
George Mason University Nanofabrication Facility

Process context

The December 2025 SOP identifies a positive-resist workstation with a spin coater, hotplate and developer, and a negative-resist workstation with a spin coater, two hotplates and developer. The documented substrate range is 1 inch to 150 mm diameter. Coating, bake and develop recipes are loaded through the module interfaces; exposure is performed on a separate exposure tool. The SOP does not identify individual module sizes or substrate materials.

Source and equipment evidence

George Mason University Nanofabrication Facility. 2025. Standard Operating Procedure: Photoresist Workstation, Cee X-Pro II. December 2025.

Equipment reference: Page 1, document identification; workstation description and operating sections.

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Application summary prepared by Cee. The original source remains the authority for its methods and findings.

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