SOP / protocol
Integrated photoresist processing in X-Pro II WorkstationsX-Pro II Workstation
MIT documents spray and puddle development with front- and backside rinsing, alongside post-exposure, image-reversal, and hard-bake steps.
The source names the installation Cee 200CBX and describes a developer and hotplate workflow. Its documented process role is retained rather than inferring a coater configuration from the model name.
The SOP identifies CD-26 and AZ-422 developers and DI-water rinsing. Equipment recommendations below follow this documented developer/bake workflow.
Payer K. 2015. develop-Brewer Hotplate and Develop Station Standard Operating Procedure. Massachusetts Institute of Technology. October 2015.
Equipment reference: Page 1, Model, Purpose, Author, and Introduction.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.