SOP / protocol

Spray and puddle development with integrated resist baking

MIT documents spray and puddle development with front- and backside rinsing, alongside post-exposure, image-reversal, and hard-bake steps.

How Cee® equipment is used

The source names the installation Cee 200CBX and describes a developer and hotplate workflow. Its documented process role is retained rather than inferring a coater configuration from the model name.

Equipment reported
Cee® 200CBX
Source type
SOP
Publication year
2015
Materials
CD-26 developer, Developer, DI Water
Substrate
Not reported
Source
MIT Fabtools

Process context

The SOP identifies CD-26 and AZ-422 developers and DI-water rinsing. Equipment recommendations below follow this documented developer/bake workflow.

Source and equipment evidence

Payer K. 2015. develop-Brewer Hotplate and Develop Station Standard Operating Procedure. Massachusetts Institute of Technology. October 2015.

Equipment reference: Page 1, Model, Purpose, Author, and Introduction.

Open original source ↗

Application summary prepared by Cee. The original source remains the authority for its methods and findings.

SEMICON EUROPA · 10–13 NOVEMBER

Bring your process questions.

Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.

Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.

Book a stand meeting →

Mention Jacob from CEE in SiSTEM’s booking form.