Facility / company reference
CNSE Innovation Lab | University at AlbanyApogee spin-coater/bake system
This procedure describes resist bake steps in University of Florida NRF lithography workflows.
The NRF lithography procedure identifies a Cee® hotplate in resist-bake steps. The recorded attribution does not specify the hotplate model.
This procedure describes the source facility’s installation. Its recipes, operating limits, and training requirements apply to that installation; consult the original procedure before use. Materials recorded for this reference include Photoresist.
University of Florida Nanoscale Research Facility. NRF Lithography Processes SOP – University of Florida.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.