Overview

The Cee® Five-Tier Passive Chill Station provides freestanding benchtop cooling for up to five substrates after bake processing. Separate tiers keep wafers apart while providing access for suitable tweezers or a vacuum wand.

Key Capabilities

• Five individual wafer tiers for post-bake cooling
• Passive operation without refrigeration or facility utility connections
• Nominal support for wafers up to 300 mm in diameter, subject to substrate geometry
• Access notches for wafer removal
• Four threaded feet for stable, level installation

Operation

Place the station on a clean, stable benchtop and adjust the feet to prevent rocking. Using suitable thermal PPE and handling tools, place each hot substrate on an available tier. Avoid dragging wafers across the contact surfaces or allowing wafers to contact one another.

Allow each substrate to reach the temperature required for handling or the next process step. Cooling time depends on starting temperature, thermal mass, surface contact, and ambient airflow; a fixed ten-second cooldown should not be assumed.

Safety & Facilities

No additional facility utilities are required. Treat recently loaded substrates and support surfaces as hot. Confirm that the station is level, stable, clean, and undamaged, with enough clearance for safe handling. Once cool, wipe surfaces with a nonabrasive cloth and a compatible cleaning agent.

Compatibility

For benchtop cooling after Apogee® Bake Plate processing. Maximum nominal wafer diameter is 300 mm; verify fit and support for the actual substrate geometry.