The right spin chuck starts with the material you need to hold. Choose your substrate below to explore the chuck family designed around its shape, support and retention needs.
Round wafers and rigid substrate pieces with a flat backside. Explore circular vacuum chucks matched to your substrate size and the area available for vacuum contact.
Square glass, photomasks and rectangular plates. For spin coating, we typically recommend a recessed chuck. For developing and cleaning, we typically recommend a captive chuck. Explore the design that fits your process.
Thin or flexible substrates benefit from broad backside support. Porous chucks distribute vacuum across the holding surface to support delicate wafers, foils and films.
Wafers mounted on dicing tape stay with their frame. Explore chucks designed to hold the framed assembly so you can process the wafer without transferring it to another holder.
Irregular parts, thick pieces and unusual shapes call for a tailored holding approach. Explore custom designs for special outlines, restricted contact areas and application-specific requirements.
Tell us your substrate material, dimensions and thickness, along with your Cee tool and process. We can help narrow down the right holding approach.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.
