A Low Tg Bonding Material for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer Level Packaging (FOWLP) Processes

How Cee® equipment is used

Slide 18 explicitly identifies the Cee® mechanical debonder for Material A. The presentation also contains thermal-slide and laser-release investigations, but those steps are not attributed to the Cee® tool. Material A is an experimental bonding material; no Cee® model number or wafer diameter is identified for the mechanical-debond test. Source: Arthur Southard, iMAPS Device Packaging Conference, April 13, 2021.

Equipment reported

Cee® equipment; model not reported

Source type

Research paper

Publication year

2021

Materials

Temporary Bonding Adhesive

Substrate

Not reported

Source

Brewer Science — iMAPS Device Packaging Conference

Process context

The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Temporary Bonding Adhesive.