Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry

How Cee® equipment is used

The study identifies a Cee® 200FX for coating benzocyclobutene films used to characterize a wafer-bonding layer by infrared spectroscopic ellipsometry. The Cee® attribution covers film preparation.

Equipment reported

Cee 200 FX

Source type

Research paper

Publication year

Not recorded

Materials

Benzocyclobutene (BCB)

Substrate

Not reported

Source

ScienceDirect

Process context

The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Benzocyclobutene (BCB).