SOP / protocol
Polyimide Shuttle Film Fabrication ProtocolApogee® 300 Bake Plate
This thesis describes silicon cantilever microfabrication for integrated SPM/SEM. The workflow uses Cee® 100CB.
Methods identify the Cee 100CB hotplate and describe TI Prime/AZ1518 lithography.
The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Photoresist.
TU Ilmenau Thesis. Fabrication and characterization of self-sensing and self-actuating piezoresistive microscale silicon cantilevers for an integrated scanning probe microscopy and scanning electron microscopy system.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.