Thesis
Fabrication and characterization of self-sensing and self-actuating piezoresistive microscale silicon cantilevers for an integrated scanning probe microscopy and scanning electron microscopy systemCee® 100CB
This process document describes multilayer polyimide shuttle-film bake and final cure. The workflow uses Apogee® 300 Bake Plate.
Protocol names the Cee Apogee300 Bake Plate in final cure of a five-layer PI stack.
This procedure describes the source facility’s installation. Its recipes, operating limits, and training requirements apply to that installation; consult the original procedure before use. Materials recorded for this reference include Polyimide.
University of Southern California Protocol. 2026. Polyimide Shuttle Film Fabrication Protocol.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.