Dispenses / Spin Coater Dispenses

Start with your coating process.

From a center puddle to a programmable scan, choose the material delivery and rinse steps that fit your spin-coating process.

Start with the dispense control box

The control box is used for automated dispensing. One control box supports up to four dispensers. Need more than four? Add more dispense control boxes to expand your system.

COATING MATERIAL DELIVERY

Form a puddle. Build the coating.

Deliver a controlled stream, then choose the reservoir or pumping system that fits your material and usage.

PROGRAMMABLE COATING DELIVERY

A major upgrade in dispense control

Expand your coating capabilities with five recipe-controlled dispense modes. Precisely position material, program arm movement, and tailor each dispense to your process.

CONTROL THE WAFER PERIMETER

Remove coating at the edge.

A narrow solvent stream creates a controlled edge exclusion during spin coating.

KEEP THE UNDERSIDE CLEAN

Rinse the back side of the wafer.

An upward liquid stream removes unwanted process material from the substrate back side.

APPLICATION-SPECIFIC DELIVERY

Build around your process.

Cee® offers customized dispense solutions for applications that need a different approach. Explore examples of our custom equipment, then contact Cee® to discuss your process requirements.

Find the right dispense for your process.

Tell us your Cee tool, substrate size, material chemistry, viscosity, and desired dispense sequence. We can help match the delivery method and fluid path to your application.