Products / Dispenses
Explore coating, developing, rinsing, and drying options for Cee® equipment. Choose your equipment type or browse every dispense method below.
The dispense control box is used for automated dispensing. One control box supports up to four dispenses. Need more than four? Add dispense control boxes to expand your system.
Deliver a controlled stream, then choose the reservoir or pumping system that fits your material and usage.
Expand your coating capabilities with five recipe-controlled dispense modes. Precisely position material, program arm movement, and tailor each dispense to your process.
Fixed fan-spray delivery for developing and cleaning processes.
Precisely position and scan the fan spray for demanding processes such as metal liftoff, precision cleaning, and high aspect ratio applications.
A narrow solvent stream creates a controlled edge exclusion during spin coating.
An upward liquid stream removes unwanted process material from the substrate back side.
A directed gas jet helps dry the wafer after wet processing.
Cee® offers customized dispense solutions for applications that need a different approach. Explore examples of our custom equipment, then contact Cee® to discuss your process requirements.
Tell us your Cee® equipment, substrate size, material chemistry, viscosity, and desired dispense sequence. We can help match the delivery method and fluid path to your application.
