Meeting the Fabrication Challenges for Backside Processing on Thin Substrates with Ultrahigh Device Topography

How Cee® equipment is used

TriQuint reports installing a Cee® 1300CSX in early 2013 and using heated chucks at 190°C for slide-off debonding of thinned device wafers. This is a jointly authored TriQuint and Brewer Science paper.

Equipment reported

Cee® 1300CSX

Source type

Customer/supplier conference paper

Publication year

2013

Materials

Temporary Bonding Adhesive

Substrate

Not reported

Source

TriQuint and Brewer Science, CS MANTECH

Process context

The process details describe the cited work. Reported recipes and results depend on the authors’ materials, substrates, and equipment configuration. Materials recorded for this reference include Temporary Bonding Adhesive.