The University of Miami BioNIUM nanofabrication facility tool listing explicitly includes a Cee® 200X Precision Spin Coater as part of its lithography-related equipment set.

This Georgia Tech paper describes direct photopatterning of mixed-metal oxide films using a photosensitive metallorganic precursor. The precursor films were spin coated onto 100 mm single-side polished silicon wafers using a Cee® Model 100 CB Spin Coater and Bake Unit

The University of Kansas Nanofabrication Facility lists a Cee® coat and bake workflow that includes a Cee® 200CBX Programmable Spin Coater, Cee® 1300X Hot Plate, and Cee® Apogee® Hot Plate. The page also states that the 200CBX supports multiple chuck sizes for a variety of substrate sizes.

The University of Michigan Lurie Nanofabrication Facility equipment directory lists multiple Cee® lithography tools, including coating, developing, and Apogee® spin coating platforms within the facility’s lithography area.

This Cornell NanoScale Facility newsletter identifies two bench-top mounted Cee® Model 100 Spin Coaters used for resist coating of wafers, with support for substrates up to 200 mm round or 6-inch square.

This Washington University report references use of AZ4620 photoresist coated onto the wafer using a Cee® 200X Spin Coater as part of the microfluidics fabrication process.

The University of Kentucky CeNSE spin coating page explicitly references the Cee® Model 100 and 150 and describes them as part of the facility’s spin coating capability for thin-film application.

Texas A&M AggieFab lists a Cee® Automatic Developer used for photoresist development following exposure, supporting lithography workflows in a university cleanroom.

The Penn Nano equipment page includes imagery of a Cee® 200X Spin Coater within its spinner and solvent processing area, indicating active use of Cee® coating equipment in the facility.

The University of Kansas Nanofabrication Facility lists a Cee® Spin Coater dedicated to PDMS coating, supporting soft lithography and polymer-based device fabrication processes.

Washington University’s Micronanofabrication Facility lists Cee® Spin Coaters as part of its lithography equipment, supporting photoresist coating and bake processes in an academic cleanroom environment.

The University of Utah Nanofab wiki lists a Cee® 100 Spin Coater used for photoresist coating in lithography processes within a shared cleanroom environment.

The Penn Nano Wiki lists a Cee® Apogee® Spin Coater used for photoresist coating in lithography processes, supporting substrates up to 6-inch wafers within a shared nanofabrication environment.

The University of Houston NanoFabrication Facility lists a Cee® Spin Coater for thin film and photoresist coating, supporting a range of lithography and polymer deposition processes within an open-access cleanroom environment.

ASU NanoFab lists Cee® Spin Coater #1 and #2 as photoresist coating systems in its cleanroom. The page explicitly identifies Cee® Spin Coater #1 as having a programmable precision hot plate bake, Cee® Spin Coater #2 as a stand-alone Spin Coater, and names the Cee® 200CBX precision coat-bake system as the integrated platform.

The University of Michigan LNF Wiki lists a Cee® Apogee® Spin Coater as a fully programmable, manual-dispense photoresist coating system that accepts pieces, 4-inch wafers, and 6-inch wafers.

The University of Michigan LNF Wiki lists a Cee® 200X photoresist spinner as a fully programmable, automatic-dispense coating system with support for 4-inch and 6-inch wafers as well as pieces up to 2 inches.

This thesis covers microscale device development for detection of melanocytic growths in the skin. In the accessible snippet from the thesis PDF, a silicon wafer is coated with OmniCoat and SU-8 3025 photoresist, and the process explicitly references use of a CEE spin coater.

This thesis presents fabrication of an optical MOEMS seismic sensor using double-sided DRIE on an SOI wafer. The process explicitly uses AZ 9260 positive photoresist on a CEE Spin Coater, along with HMDS priming and hot plate bake steps, tying Cee® coating equipment directly to university device fabrication.

This publication describes a wafer-level bonding process for a dielectrophoretic microfluidic chip. The exposed source text explicitly states that SU8-5 photoresist was spun on a dummy silicon wafer using a CEE spin coater in a two-step recipe, followed by detachment on a vacuum hot plate at 150°C before alignment and bonding.

This preprint presents a method for integrating colloidal quantum emitters with silicon photonic structures using lithographically defined resist cavities. The accessible full-text snippets explicitly identify AZ-nLOF 2020 coated on a Cee® Apogee Spin Coater at 2000 rpm for 60 s, with PMMA also referenced in the process flow.

MIT’s Fabtools listing explicitly references Cee® 200X-F and Cee® 200X spin coaters within its shared nanofabrication tool set. The indexed listing associates these systems with Spinner-EBL, Spinner-Polymer, and Photo / Coat usage categories.

The Washington Nanofabrication Facility tool list explicitly includes a Cee® Apogee Spin Coater within its Lithography and Direct Patterning area.

Utah Nanofab lists multiple specific Cee® tools across its cleanroom lithography workflow, including legacy Cee® 100 and 200X-series spinners, a Cee® 200XD develop spinner, and current-generation Apogee® spin coat and bake capability. The site also explicitly lists supported resist materials used within its photolithography process set.